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Improvement of a Frame Ground Contact Between a System and Micro Channel Architecture Adapter

IP.com Disclosure Number: IPCOM000112467D
Original Publication Date: 1994-May-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Satoh, M: AUTHOR

Abstract

Disclosed is an improved mechanical design for the frame ground contact between a system and a Micro Channel Architecture* (MCA) adapter. The grooves on the rails for the brackets of the MCA adapter make the frame ground contact improved. By means of the increased number of contact points and the pin-point or acute-angled contacts, Electro-Magnetic Interference (EMI) characteristics are improved and the frame-ground-level is kept steady.

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Improvement of a Frame Ground Contact Between a System and Micro
Channel Architecture Adapter

      Disclosed is an improved mechanical design for the frame ground
contact between a system and a Micro Channel Architecture* (MCA)
adapter.  The grooves on the rails for the brackets of the MCA
adapter make the frame ground contact improved.  By means of the
increased number of contact points and the pin-point or acute-angled
contacts, Electro-Magnetic Interference (EMI) characteristics are
improved and the frame-ground-level is kept steady.

      Fig. 1 shows the grooves 1 on the rails 2 of the system 3 for
the bracket 4 of the MCA adapter.  The bracket 4 of the MCA* adapter
has several projections 5 on both sides thereof.  The projections 5
on both sides of the bracket contact with the corresponding grooves 1
as shown in Fig. 2.  The grooves 1 double the contact points between
the rails 2 of the system 3 and the bracket 4 of the MCA adapter.

      Moreover, each edge 6 of the grooves 1 of this system 3, rather
than a conventional flat plane of the system which has no grooved
rails, provides a pin-point contact or an acute-angled contact with
the projection 5, thereby further improving EMI characteristics.

Any direction of the longitudinal axis of each groove 1 is acceptable
to this mechanism.

*  Trademark of IBM Corp.