Browse Prior Art Database

Solid Particle Usage in Large Hermetic Modules

IP.com Disclosure Number: IPCOM000112491D
Original Publication Date: 1994-May-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Lake, JK: AUTHOR [+4]

Abstract

Disclosed herein is a design concept that utilizes solid electrically nonconducting particles as a space filler and path of thermal conduction in large cavity hermetic devices. This invention eliminates expansion due to pressure differentials between the gas filled hermetic cavity and outside environment and enhances the ability of the module to cool internal devices. The elimination of the expansion reduces stress on the weld/braze which in turn allows the use of thinner hermetic covers which historically have higher yields with standard hermetic sealing processes.

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Solid Particle Usage in Large Hermetic Modules

      Disclosed herein is a design concept that utilizes solid
electrically nonconducting particles as a space filler and path of
thermal conduction in large cavity hermetic devices.  This invention
eliminates expansion due to pressure differentials between the gas
filled hermetic cavity and outside environment and enhances the
ability of the module to cool internal devices.  The elimination of
the expansion reduces stress on the weld/braze which in turn allows
the use of thinner hermetic covers which historically have higher
yields with standard hermetic sealing processes.

      In this design electrically insulative, thermally conductive
powder including but not limited to silicon carbide, silicon nitride
or powdered polymers are used to fill the cavity of the module after
population.  The powder is carefully compressed and filled to the
cover level.  The cover is then sealed using a seam or laser weld
technique.

      Since the volume of internal cavity is reduced, pressure
differentials when the module is exposed to vacuum/space environment
will also be reduced.  Also, since the powder is in direct physical
contact with the cover/module body an additional cooling path for the
electronic device is created.  By using powder instead of silicone
potting type compounds, removal of the powder can be a dump vacuum
process which will facilitate any repair of the module.