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Specification Compliant Coat and Fill Process

IP.com Disclosure Number: IPCOM000112516D
Original Publication Date: 1994-May-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Boyle, DB: AUTHOR [+2]

Abstract

Disclosed is a process to solve the problem of providing adequate thermal fill beneath components without violation of the military specification coating thickness (0.003 +-0.002") and without additional component fill operations such as capillary action-based fill, vacuum fill, or selective bonding of components.

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This is the abbreviated version, containing approximately 78% of the total text.

Specification Compliant Coat and Fill Process

      Disclosed is a process to solve the problem of providing
adequate thermal fill beneath components without violation of the
military specification coating thickness (0.003 +0.002") and without
additional component fill operations such as capillary action-based
fill, vacuum fill, or selective bonding of components.

      The advent of selective coating via computer-controlled
non-atomized application methods enable the combination of the
filling and coating operations into a single operation.  Previously,
this was only possible through the use of a non specification
compliant coating thickness and vacuum cycles.  Using the selective
method, the tip of the film coating gun is rotated such that the
laminar 2-dimensional spray is parallel to the leaded sides of the
component and directly over the leads on one side of the component at
a fixed height.  Next, the spray is actuated to dispense a controlled
amount of coating.

      Initially, the coating material is forced under the component
due to the pressure in the fluid system, and a small excess of
material collects at the base of the component body.  Immediately
after the material is applied, capillary action draws more material
from the excess to fill most of the volume beneath the component.
The spray is then actuated along the opposite side of the component,
completing the application of the thermal enhancement material
beneath the component body.

    ...