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Thermal Conducting/Electrical Insulating Coating Copper Foil Used in Coil Making

IP.com Disclosure Number: IPCOM000112552D
Original Publication Date: 1994-May-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Frankeny, J: AUTHOR [+2]

Abstract

The present coil design for the magnetic repulsion punch only allows cooling down the length of the coil. Fins and radial cuts are being added to end of coil to get better cooling. Figs. 1a and 1b shows a present coil which is wound from thin copper foil.

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Thermal Conducting/Electrical Insulating Coating Copper Foil Used
in Coil Making

      The present coil design for the magnetic repulsion punch only
allows cooling down the length of the coil.  Fins and radial cuts are
being added to end of coil to get better cooling.  Figs. 1a and 1b
shows a present coil which is wound from thin copper foil.

      There is a material that is "diamond-like carbon" that can be
"sprayed" on the copper and it has the properties of good thermal
conductivity, as great or greater than copper.  It is applied using
"Chemical Vapor Deposition" (CVD).

      This disclosure recommends that we coat the copper foil with
the "diamond" material then use conducting epoxy to bond the coil
together and then the cooling will go from inside diameter to outside
diameter as well as along the length (Fig. 2).  This will greatly
improve cooling capacity of coil.