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Thermal Conductive Adhesive

IP.com Disclosure Number: IPCOM000112609D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Frey, BD: AUTHOR [+3]

Abstract

To provide an effective thermal adhesive bond between the semiconductor device (chip) and a heat sink in an electronic package assembly, a new thermal adhesive was formulated to meet the demands of an encapsulated module. This eliminates the need for a module cap by permitting the chip to be directly bonded to the heat sink. The adhesive was formulated as follows: Dow Sylgard "3-6568" resin and catalyst 50%(1:1) mixture with additive zinc oxide ranging from 40-80%. The mixture forms a paste which is thinly and continuously applied to the silicon device - aluminum heat sink interface. The assembly was heated to 120 - 140 degrees centigrade for 45-60 minutes. Thermal tests have proven the adhesive to be effective.

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Thermal Conductive Adhesive

      To provide an effective thermal adhesive bond between the
semiconductor device (chip) and a heat sink in an electronic package
assembly, a new thermal adhesive was formulated to meet the demands
of an encapsulated module.  This eliminates the need for a module cap
by permitting the chip to be directly bonded to the heat sink.  The
adhesive was formulated as follows:  Dow Sylgard "3-6568" resin and
catalyst 50%(1:1) mixture with additive zinc oxide ranging from
40-80%.  The mixture forms a paste which is thinly and continuously
applied to the silicon device - aluminum heat sink interface.  The
assembly was heated to 120 - 140 degrees centigrade for 45-60
minutes.  Thermal tests have proven the adhesive to be effective.