Browse Prior Art Database

Mask Structure and Attach Method for Extrusion-Type Solder Bump-Forming Apparatus

IP.com Disclosure Number: IPCOM000112709D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Nishimura, H: AUTHOR [+2]

Abstract

Disclosed is a mask structure and attach method for an extrusion-type solder bump-forming apparatus. A detachable and deformable thin plate is used as a solder extrusion mask.

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This is the abbreviated version, containing approximately 100% of the total text.

Mask Structure and Attach Method for Extrusion-Type Solder Bump-Forming
Apparatus

      Disclosed is a mask structure and attach method for an
extrusion-type solder bump-forming apparatus.  A detachable and
deformable thin plate is used as a solder extrusion mask.

      Fig. 1 shows the schematic design of the mask.  The mask 1
consists of a thin plate which is non-wettable to the solder.  The
mask has holes 2 for extrusion of molten solder and grooves 4 for air
communication between the holes and ambient.  The holes 2 and grooves
4 can be formed by etching with ease.

      Fig. 2 shows a cross-sectional view of a solder chamber with
the mask attached thereto.  The mask is attached to the bottom of the
chamber as shown, and the mask tension is adjusted by screw H to
cause the mask to tightly contact the lower end of the solder
chamber.  In this case, multiple masks also can be attached in the
same manner.