Browse Prior Art Database

Blends of Photosensitive and Non-Photosensitive Polyimides

IP.com Disclosure Number: IPCOM000112805D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Angelopoulos, M: AUTHOR [+4]

Abstract

Schematic Illustration of Linewidths Characteristic of a PSPI Before and After Thermal Cure

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This is the abbreviated version, containing approximately 52% of the total text.

Blends of Photosensitive and Non-Photosensitive Polyimides

       Schematic Illustration of Linewidths Characteristic of a
PSPI Before and After Thermal Cure

      Disclosed is a method of attaining photosensitive polyimides
which exhibit less linewidth deterioration upon thermal cure than is
observed with most photosensitive polyimides that undergo a volume
shrinkage during the cure process.

      Polyimides are used extensively in the microelectronics
industry.  Applications include passivation layers on integrated
circuits, interlevel dielectrics for multilevel interconnections in
electronic packaging structures, and alignment layers for liquid
crystal displays.  Polyimides have most commonly been patterned
indirectly using conventional photoresist technology.  This is a
cumbersome process as it requires processing and imaging of the
photoresist, pattern transfer to the underlying polyimide and finally
removal of the photoresist.  Photosensitive polyimides (PSPIs)
provide significant process simplification as the polyimide is imaged
directly eliminating the need for secondary photoresists.  For this
reason, considerable effort has focused on the development of PSPI
systems [1,2].  Negative PSPIs are generally composed of polyamic
acid derivatives such as esters or salts containing monoethylenically
or monoacetylenically unsaturated groups.  Poly(ethylmethacryl amic
esters) are the most common.  Positive PSPIs are most commonly based
on deblockable esters.  In either case, PSPIs can delineate high
resolution patterns with excellent linewidths after develop [3].
However, one major disadvantage of these type of systems is that
during thermal cure as the photopackage is removed to form the
polyimide, significant volume shrinkage occurs.  The volume shrinkage
and "plasticization" of the polyme...