Browse Prior Art Database

Modular Optical Rail Mirco-Bench Plastic Molded Package

IP.com Disclosure Number: IPCOM000112827D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 98K

Publishing Venue

IBM

Related People

Bona, GL: AUTHOR [+5]

Abstract

The article describes a specific concept designed for optical transmitter/receiver modules based on silicon submounts and an injection-molded plastic housing which has great potential for low-cost manufacturing. Possible applications in the field of data communications are parallel high-speed and high-capacity interconnects for optical switches, workstation clusters or even between processor chips.

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This is the abbreviated version, containing approximately 52% of the total text.

Modular Optical Rail Mirco-Bench Plastic Molded Package

      The article describes a specific concept designed for optical
transmitter/receiver modules based on silicon submounts and an
injection-molded plastic housing which has great potential for
low-cost manufacturing.  Possible applications in the field of data
communications are parallel high-speed and high-capacity
interconnects for optical switches, workstation clusters or even
between processor chips.

      Fig. 1 is a perspective view of the transmitter module.  The
module consists of a plastic body 1 fabricated by high-pressure
injection molding as well as a silicon submount 2, a connecting part
3 made of plastic and two guiding pins 4.  The guiding pins 4 serve
as the mechanical reference to which all other parts are aligned.
The plastic body 1 acts as a base for all other components.  The
guiding pins 4 are sandwiched between the plastic body 1 and the
connecting part 3.  The body 1 holds the silicon submount 2 plus the
attached heatsink, and guides the commercially available Mechanically
Transferable (MT) connector 5 during insertion.  The plastic body 1
can also contain electrical pins in a standard 100 mil raster for
mounting the module on a circuit board.

      The silicon submount 2 carries the laser array 6, which will be
mounted junction-side-down, as well as additional electronic
components (drivers, logic) and a wiring level.  Together with an
attached metal block it serves as an effective heat sink for the
generated heat.  The silicon submount 2 can be aligned by etched
V-grooves with submicron precision relative to the guiding pins 4.
The submount 2 contains further provisions for mounting and aligning
the laser array 6, e.g., shallow etched grooves or features made of
electroplated gold.

      Our approach is based on butt-coupling the laser array 6 and
the fiber ribbon.  The plastic connecting part 3 contains V-grooves
in which optical fibers are placed and which are polished on both end
faces.  This part mechanically decouples the laser array 6 from the
removable MT connector 5.  In addition to protecting the delicate
laser facet, this plastic connecting part matches the mode of the
elliptical laser output to the 50-&mu.m-diameter core of the gra...