Browse Prior Art Database

Dynamic Update Capability Determining Planar Board Features

IP.com Disclosure Number: IPCOM000112839D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Schmitt, E: AUTHOR [+2]

Abstract

Described is the use of data in a dynamic manufacturing field, stored in an Electrically Erasable Programmable Read Only Memory (EEPROM) module on a planar (system) board as an Extended Programmable Option Select IDentification (POS ID) field, to indicate features of the planar board. This word field, which is dependent on the planar board, can be upgraded to reflect a large number of combinations of features.

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Dynamic Update Capability Determining Planar Board Features

      Described is the use of data in a dynamic manufacturing field,
stored in an Electrically Erasable Programmable Read Only Memory
(EEPROM) module on a planar (system) board as an Extended
Programmable Option Select IDentification (POS ID) field, to indicate
features of the planar board.  This word field, which is dependent on
the planar board, can be upgraded to reflect a large number of
combinations of features.

      The dynamic capability of this process makes it possible to
indicate various functional changes applied to the planar board
during the manufacturing process, indicating particularly the
functions supported by the planar board.  While the word field can be
used as a fully encoded or bit-significant field, in which an
individual bit has a significance independent of the values of other
bits, the fully encoded field has more range.  This word field
becomes the dynamic extension to the planar POS ID, indicating, when
necessary, any last-minute change in function.

      This process is particularly useful for indicating features
which cannot be adequately described using the POS ID, such as
processor speed changes, the presence of a coprocessor, the
population of cache memory, the presence of a SCSI or IDE bus on the
planar, or whether hot plug features are included.  Fig. 1 describes
the general contents of this field.

      Fig. 2 shows a block diagram of the process used in t...