Browse Prior Art Database

Hybrid to Flex Circuit Assembly Machine

IP.com Disclosure Number: IPCOM000112853D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Atkins, A: AUTHOR

Abstract

Disclosed is a solder assembly machine to attach a ceramic hybrid circuit and a pair of wire connections to pre-soldered sites on a flexible circuit. Two designs of thermodes for jumper leads to flex and hybrids to flex are divulged.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 73% of the total text.

Hybrid to Flex Circuit Assembly Machine

      Disclosed is a solder assembly machine to attach a ceramic
hybrid circuit and a pair of wire connections to pre-soldered sites
on a flexible circuit.  Two designs of thermodes for jumper leads to
flex and hybrids to flex are divulged.

      The machine for a manufacturing plant is designed to be generic
for follow-on products of similar nature where hot bar reflow of
soldered joints is the primary connection method.  An embodiment
shown in Fig. 3 comprises a base plate 1 supporting a rotating,
indexed work Table 2 or with six identical work tooling ports 3.
Integral in the design are proprietary hot bar reflow and hot gas
heating equipment 4 with separate units housing pneumation 5,
controls 6 and an automatic fluxing station 7.

The machine functions are listed below:

1.  It enables alignment and assembly of ceramic hybrids, flex CCTs
    and jumper leads on tooling posts by means of a bonding head 8 in
    each bonder assembly 9.

2.  It automatically applies flux from reservoir and pump 11, at the
    fluxing station 7 to areas of parts to be solder reflow bonded.

3.  Preheating of the hybrid/flex is done by the hot gas unit 5 prior
    to bonding.

4.  It also reflows the solder joint at hybrid/flex interface.
    (Bonder A)

5.  It also reflows the solder joint at jumper lead/flex interface.
    (Bonder B)

6.  Finally it provides an assembled component cooldown stage 10
    prior to part ha...