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Browse Prior Art Database

Alternative Processor Cooling Technique

IP.com Disclosure Number: IPCOM000112918D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 63K

Publishing Venue

IBM

Related People

Butterbaugh, MA: AUTHOR [+5]

Abstract

Disclosed is a method to enhance cooling on thermally in-line modules in a single electronics package. This method is for increasing the cooling performance to multiple processors in a single electronic package, when cooling airflow is serial across the modules. An air duct is attached to the package which allows unheated air to reach the second processor.

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This is the abbreviated version, containing approximately 100% of the total text.

Alternative Processor Cooling Technique

      Disclosed is a method to enhance cooling on thermally in-line
modules in a single electronics package.  This method is for
increasing the cooling performance to multiple processors in a single
electronic package, when cooling airflow is serial across the
modules.  An air duct is attached to the package which allows
unheated air to reach the second processor.

      Fig. 1 shows a card and electronics package with two processor
modules (labeled P1 and P2) and air flow direction.  With this
arrangement of modules and air flow, the downstream module (P2) will
receive pre-heated air from the upstream module (P1).  Also, air will
tend to bypass both processor modules.  The pre-heated air coupled
with the bypass air may impact module reliability and/or function.

      Fig. 2 shows a card and electronics package with an additional
air duct attached and perforations in the package that allow the air
to pass thru.  Fig. 3 describes the air flow directions.  If the air
pressure outside the package is higher than the pressure inside, air
will flow thru the perforations in the package, thru the duct, and
across the second module.  The air duct will also reduce the amount
of air that would normally by-pass the modules P1 and P2 by providing
additional air blockage (impedance).  Under the right conditions,
this will result in lower module temperatures for the P2 module and
little or no impact on the upstream module P1.