Browse Prior Art Database

Process Design to Simultaneously Fabricate Top/Bottom Surface Metallurgy

IP.com Disclosure Number: IPCOM000112921D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Beaman, B: AUTHOR [+7]

Abstract

Disclosed is a unique way of simultaneously fabricating the top and bottom surface metallurgy on a ceramic multilayer package.

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Process Design to Simultaneously Fabricate Top/Bottom Surface Metallurgy

      Disclosed is a unique way of simultaneously fabricating the top
and bottom surface metallurgy on a ceramic multilayer package.

      The metallurgy to be fabricated is likely to be a Cr/Cu/Ni/Au
sequence.  The same metallurgy will be used for both the top and
bottom surfaces, for wire bonding and C4 joining.  To take advantage
of the symmetrical structure, we are proposing to process the same
metallurgy on both surfaces simultaneously.  This key feature, will
significantly reduce the total process time required for formation of
the surface metallurgy.

      The process used is to first put down a seed layer.  This is
followed by deposition of a photoresist, which is subsequently
patterned and developed.  Then the metallurgy is electroplated.
Finally the resist and seed layers are removed.