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Browse Prior Art Database

Circuit Repair Using Palladium Seeding and Selective Electroless Plating

IP.com Disclosure Number: IPCOM000112948D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Vigliotti, DR: AUTHOR [+2]

Abstract

The present disclosure describes a new technique for the repair of an open circuit using palladium seeding and selective electroless plating.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 59% of the total text.

Circuit Repair Using Palladium Seeding and Selective Electroless
Plating

      The present disclosure describes a new technique for the repair
of an open circuit using palladium seeding and selective electroless
plating.

      The region of a break or open in the circuit is first seeded
with palladium acetate.  A laser is used to drive off the organic
ligands of the palladium acetate, leaving behind a "bridge" of
essentially pure palladium metal.  The palladium bridge establishes
an electrically continuous circuit of a high resistance over the
open.  Such palladium seeding techniques have been described
previously in the literature.

      The circuits is then immersed in an electroless copper-plating
solution heated to a temperature of about 40ºC.  Certain
formulations of electroless copper-plating solutions when heated to
such a temperature give rise to selective copper plating.  In the
present technique, the high-resistance palladium bridge increases in
thickness due to deposition of copper, whereas copper essentially
does not plate out on the copper lines of the circuit.  The selective
plating on the seeded region occurs without the use of a mask.  Thus,
it becomes possible to repair a number of palladium-seeded opens on a
single substrate in a batch-process manner by submerging the
substrate in electroless copper-plating solution to build up copper
on the opens to obtain low-resistance repairs.

      In one specific example, a copper line had...