Browse Prior Art Database

Effect of Low Pressure on Cure Processes in Epoxies

IP.com Disclosure Number: IPCOM000112985D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Bolding, RM: AUTHOR [+3]

Abstract

Disclosed is a process whereby the application of vacuum during the cure cycle of epoxy resins permits the use of lower cure temperatures and shorter cure times. The resultant cured material additionally exhibits enhanced properties.

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Effect of Low Pressure on Cure Processes in Epoxies

      Disclosed is a process whereby the application of vacuum during
the cure cycle of epoxy resins permits the use of lower cure
temperatures and shorter cure times.  The resultant cured material
additionally exhibits enhanced properties.

      Electronic packaging techniques such as Direct Chip Attach and
Solder Ball Connect require the use of encapsulants between the part
and the carrier to which it is attached.  Because of the temperature
sensitivity of some of the adjacent components on the circuit board,
the cure temperature of the encapsulant is required to be low.  Using
lowered cure temperatures results in a corresponding lengthening of
the cure time.  For example, to cure Hysol* FP4510, a Direct Chip
Attach encapsulant, requires 4 hours at 130ºC.  Using an
acceptably lowered cure temperature of 100ºC requires 6 hours of
cure time.  These cure times seriously affect the manufacturing
throughput.  Experiments described in this disclosure have indicated
that vacuum curing can reduce the curing time and enhance the
properties of the cured resin, even when cured at the lower
temperatures.

      The effect of vacuum (10 E-4 torr) on the cure processes of two
typical anhydride cured epoxy resin systems was investigated.  The
investigation showed that the vacuum curing allowed the use of
reduced cure temperatures and shorter cure times.  Both resin systems
showed a reduction in the energy requir...