Browse Prior Art Database

Power Supply Metal Generation Method

IP.com Disclosure Number: IPCOM000112999D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Kudo, M: AUTHOR

Abstract

Disclosed is a power supply metal generation method for LSI chips. There are metal layers in LSI chips to connect circuits and to supply power to the circuits. A shape processing algorithm creates power supply metals at the completion of circuit connections.

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This is the abbreviated version, containing approximately 100% of the total text.

Power Supply Metal Generation Method

      Disclosed is a power supply metal generation method for LSI
chips.  There are metal layers in LSI chips to connect circuits and
to supply power to the circuits.  A shape processing algorithm
creates power supply metals at the completion of circuit connections.

      The circuit connection uses the metal layers as much as it
needs prior to the power supply metal generation.  The shape
processing algorithm checks where the circuit connection metals exist
and picks up areas which are vacant for power supply metals.  Then
the shape processing algorithm generates the power supply metals on
the vacant areas and fixes their width or form.  The interconnections
between metal layers are added if required.

      The prereserved power supply metals are effective to keep
minimum power supply metals prior to the circuit connection.  After
the completion of circuit connection, the shape processing algorithm
generates additional power supply metals in the same manner.

      The shape processing algorithm may be replaced by something
equivalent.  This method achieves the fully utilized metal layers,
the large capacity of power supplies and the easier solution of
circuit connection problem.