Browse Prior Art Database

Two High-Processor Modules on Cross Road Flex

IP.com Disclosure Number: IPCOM000113020D
Original Publication Date: 1994-Jun-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Brezina, JR: AUTHOR [+2]

Abstract

The Figure shows a method of packaging multi-chip processor modules in the central electronics complex of a supercomputer assembly. The electronic switch 1 is connected to the memory card 2 and also to the processor modules 3 by radial flex cables 4. The processor flex cables are angled such that heat sinks 5 are mounted onto the multi-chip processor modules one above the other and in the same radial plane. This arrangement may be repeated on additional radial flex cables. Such an arrangement will enhance the cooling air flow path to the heat sinks and improve mechanical assembly by doubling the number of processor modules per radial plane.

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Two High-Processor Modules on Cross Road Flex

      The Figure shows a method of packaging multi-chip processor
modules in the central electronics complex of a supercomputer
assembly.  The electronic switch 1 is connected to the memory card 2
and also to the processor modules 3 by radial flex cables 4.  The
processor flex cables are angled such that heat sinks 5 are mounted
onto the multi-chip processor modules one above the other and in the
same radial plane.  This arrangement may be repeated on additional
radial flex cables.  Such an arrangement will enhance the cooling air
flow path to the heat sinks and improve mechanical assembly by
doubling the number of processor modules per radial plane.