Browse Prior Art Database

Inner Lead Bond Lead Reform

IP.com Disclosure Number: IPCOM000113137D
Original Publication Date: 1994-Jul-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Darrow, RE: AUTHOR [+3]

Abstract

The original chip bonding process consists of bonding the chip to non-reformed leads. This disclosure uses a new concept that accomplishes downsetting and reforming prior to chip bonding.

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This is the abbreviated version, containing approximately 100% of the total text.

Inner Lead Bond Lead Reform

      The original chip bonding process consists of bonding the chip
to non-reformed leads.  This disclosure uses a new concept that
accomplishes downsetting and reforming prior to chip bonding.

      As shown in the Figure, the cantilevered inner leads of a
flexible film chip carrier are reformed prior to thermal compression
bonding of the IC chip to the inner leads.  This lead reform provides
the necessary clearance to prevent shorting between the edges of the
chip and the inner leads.  It also eliminates the need for a
"downsetting" operation, which is normally done to prevent the
prviously mentioned shorting condition, as well as the high
mechanical stress places on the inner lead bonded joint as a result
of the downsetting operation.  However, for this concept to work well
the ILB leads must remain in alignment.  This may be done with proper
tolling or use of a guard support bar.