Browse Prior Art Database

Extraction Tool for Plastic Leaded Chip Carrier Modules Modules

IP.com Disclosure Number: IPCOM000113179D
Original Publication Date: 1994-Jul-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Kagan, JJ: AUTHOR [+4]

Abstract

Disclosed is an extraction tool for aiding in the removal of a Plastic Leaded Chip Carrier (PLCC) module from its socket. A need may arise for such removal, for example, to replace a defective part, to provide a circuit with upgraded function, or to engage in diagnostic testing requiring the removal of the circuit.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 78% of the total text.

Extraction Tool for Plastic Leaded Chip Carrier Modules Modules

      Disclosed is an extraction tool for aiding in the removal of a
Plastic Leaded Chip Carrier (PLCC) module from its socket.  A need
may arise for such removal, for example, to replace a defective part,
to provide a circuit with upgraded function, or to engage in
diagnostic testing requiring the removal of the circuit.

      Fig. 1 is a plan view of a PLCC module 10 fitting into a mating
socket 12, which is in turn soldered to a printed circuit card 14.
Socket 12 includes a number of electrical contact springs 16
extending along the sides of module 10 to make electrical connections
with contact pads on the sides of the module.

      Fig. 2 is a partial cross-sectional elevation, taken in along a
diagonal as indicated by section lines II-II of Fig. 1, showing
additionally an extraction tool 18 in position to aid in the removal
of module 10 from socket 12.  This tool 18 includes a small diameter
pin portion 20, fitting into one of the diagonally extending slots 21
at diagonally opposite corners of socket 12, to engage and adjacent
corner 22 of module 10.  As a handle portion 24 of the tool is
pivoted in the direction of arrow 26, a first step 28 of the tool
comes in contact with an upper surface 30 of socket 12, bridging the
width of slot 21.  In this way, the downward reaction forces from the
tool, generated as corner 22 of module 10 is pried upward, act on the
upper surface 30, instead of o...