Browse Prior Art Database

Universal Power Distribution System for Large Processor/Memory

IP.com Disclosure Number: IPCOM000113186D
Original Publication Date: 1994-Jul-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 6 page(s) / 112K

Publishing Venue

IBM

Related People

Myers, KH: AUTHOR [+2]

Abstract

General power distribution systems require redesign for the different board amperage requirements >2000 Amps. This design utilizes a power distribution system capable of growing with future amperage needs.

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Universal Power Distribution System for Large Processor/Memory

      General power distribution systems require redesign for the
different board amperage requirements >2000 Amps.  This design
utilizes a power distribution system capable of growing with future
amperage needs.

      The basic concept provides even current flow around the
periphery of the board.  This is accomplished by using a cooled
lightweight high power connector.  This connector is integrated into
the universal lightweight high power frame surrounding the board as
shown in Fig. 1.

      The cooled lightweight frame and power connector utilizes a
manifold design concept which allows fluids/gases to flow thru the
universal power distribution system.  This allows for a significant
reduction in weight and design for power amperage requirements
greater than 2000 Amps.

      Fig. 1 describes a board system capable of delivering <14,000
Amps.  For example, a 2" x 4" copper bus used to carry current around
the board periphery with minimum voltage drop can be reduced to a
3/4" x 3/4" outer wall cross-section to carry 14 KAmps or less.  The
weight of the hollow manifold is significantly lower than providing
water jackets for cooling solid copper bus bars on and off the
board(s).

      This approach requires sensors to monitor fluids/gases as well
as thermistors.  Figs. 2,3,4 and 5 describe a 10.2 K Amp design with
mechanical and electrical definition of board design for a High Power
C...