Browse Prior Art Database

Component Removal Process

IP.com Disclosure Number: IPCOM000113209D
Original Publication Date: 1994-Jul-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

The process illustrated in the Figure was developed to remove Pin Grid Array components from Printed Wiring Boards while simultaneously removing the solder from the plated through holes of the Printed Wiring Board.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Component Removal Process

      The process illustrated in the Figure was developed to remove
Pin Grid Array components from Printed Wiring Boards while
simultaneously removing the solder from the plated through holes of
the Printed Wiring Board.

      Hot heat transfer fluid 1 is pumped through nozzle 2 of
conventional dynamic solder pot 3 at a temperature higher than the
melting point of the solder to be removed.  The head transfer fluid 1
passes through perforated stainless steel plate 4 attached to solder
pot 3 by fasteners 5, forming fluid wave 6 which immerses copper wire
woven mesh pad 7 which is attached to perforated stainless steel
plate 4 by removable fasteners 8.  Pin Grid Array component 9
soldered into the plated through holes 10 of Printed Wiring Board 11
is placed over fluid wave 6 and lowered such that the solder fillets
12 contact copper wire woven mesh pad 7.  Hot fluid wave 6 reflows
solder joints 12.  Pin Grid Array component 9 is removed from Printed
Wiring Board 11.  The solder in the plated through holes 10 is drawn
into the copper wire woven mesh pad 7 by capillary action and the
Printed Wiring Board 11 is withdrawn from fluid wave 6.