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Venturi-Aided Forced Convection Cooling of Electronic Cards

IP.com Disclosure Number: IPCOM000113213D
Original Publication Date: 1994-Jul-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Purcell, JD: AUTHOR

Abstract

Disclosed is a method to alleviate regions of elevated temperature on electronic card assemblies caused by lack of cooling air circulation. Air stagnation usually occurs near a mounting bracket due to the bracket being non-porous, thus preventing passage of air. When a card stands vertically, natural convection influences horizontal airflow towards the card upper area, thus exacerbating air stagnation in the lower card region.

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This is the abbreviated version, containing approximately 79% of the total text.

Venturi-Aided Forced Convection Cooling of Electronic Cards

      Disclosed is a method to alleviate regions of elevated
temperature on electronic card assemblies caused by lack of cooling
air circulation.  Air stagnation usually occurs near a mounting
bracket due to the bracket being non-porous, thus preventing passage
of air.  When a card stands vertically, natural convection influences
horizontal airflow towards the card upper area, thus exacerbating air
stagnation in the lower card region.

      In this method, a fan is used to accelerate air through a
venturi, thus creating a region of reduced pressure.  Stagnant air is
evacuated via a conduit extending between region of the stagnant air
and the region of reduced pressure.  Air moving to fill the void
created by evacuation causes circulation of cooling air in a region
formerly stagnant.  By utilizing a fan normally found in an
electronic system, such as in the system power supply, no additional
fan costs are incurred.

      The Figure shows a system where the motherboard is located
above the power supply and supports plug-in cards.  A fan moves air
horizontally across the plug-in card(s).  However, because of
blockage by mounting brackets, the air exit vents are located above
the card(s).  As a result, cooling airflow tends toward the vents and
away from the lower, bracket corner of the card(s), producing a
region of elevated temperature.  The power supply fan is located in
such a manner as to al...