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Browse Prior Art Database

High Temperature Stable Copper Corrosion Inhibitor

IP.com Disclosure Number: IPCOM000113246D
Original Publication Date: 1994-Jul-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Lee, K-W: AUTHOR [+3]

Abstract

Disclosed is a new organic material for high temperature copper corrosion inhibition.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 70% of the total text.

High Temperature Stable Copper Corrosion Inhibitor

      Disclosed is a new organic material for high temperature copper
corrosion inhibition.

      Copper is widely used in electronic industries since it has an
excellent electrical conductivity, and it is also cheap and readily
available.  However, copper oxidizes in air, specially in the high
humidity.  Oxygen, moisture and temperature facilitate oxidation.  If
the copper surface is oxidized to some extent, cohesive strength of
the surface layer becomes weak and adhesion of polymer to copper also
becomes poor.  To maintain structural integrity of copper and to
obtain reliable adhesion of other material (metal, polymer, etc.)  to
copper, the copper surface should be inhibited from corrosion.  A
compound containing triazole or imidazole functionality is well known
to react with copper to form a cuprous (I) complex1-6
Specially benzotriazole and benzimidazole have been used for this
purpose and their reaction of copper has been investigated
extensively.  However, these compounds decompose at lower than
250ºC.  Thus they cannot be used in high temperature
applications.

      8-Azaadenine and adenine, which are thermally stable, are good
copper corrosion inhibitors.  The melting points of 8-azaadenine and
adenine are greater than 300ºC and 360ºC, respectively while
the melting point of benzotriazole is only 99ºC.  These melting
point differences indicate that 8-azaadenine and adenine are much
more s...