Browse Prior Art Database

Pinned Grid Array High Density Electronic Substrate

IP.com Disclosure Number: IPCOM000113276D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Hayden, TF: AUTHOR [+4]

Abstract

Disclosed is a means of producing a Pin Grid Array (PGA) version of a high density electronic substrate for use as a Single Chip Module (SCM) or Multi-Chip Module (MCM). The electronic substrate (1,2) consists of a laminated stack of 1S1P circuit elements. The laminated substrate provides an interface for connection to a carrier through studs which have been plated with a joining metallurgy (typically eutectic tin/lead).

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Pinned Grid Array High Density Electronic Substrate

      Disclosed is a means of producing a Pin Grid Array (PGA)
version of a high density electronic substrate for use as a Single
Chip Module (SCM) or Multi-Chip Module (MCM).  The electronic
substrate (1,2) consists of a laminated stack of 1S1P circuit
elements.  The laminated substrate provides an interface for
connection to a carrier through studs which have been plated with a
joining metallurgy (typically eutectic tin/lead).

      The carrier is a traditional ceramic package modified so that
the contact points or pads on the top surface of the carrier have
been plated with palladium dendrites, described in (3).  The areas of
dendrite plating may also be further defined by a photo-imageable
imageable solder mask on the top surface of the carrier.  The ceramic
package is terminated with metal pins which can be inserted into a
socket or vias on a printed wiring board.

      As shown in Fig. 1, the substrate terminates with studs which
protrude from the bottom of the laminate.  Correspondingly, the
carrier, shown in Fig. 2, contains photodefined cavities located
above vias in the carrier, which have been plated with palladium
dendrites.  Vias terminate on the bottom of the carrier with a metal
pin.  When joined, using the same laminating and bonding technology
in (1,2), the assembly is as appears in Fig. 3.

      The advantage of merging a high wiring density electronic
substrate with a pinned car...