Browse Prior Art Database

Integrated Packaging Design

IP.com Disclosure Number: IPCOM000113326D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 77K

Publishing Venue

IBM

Related People

Farringer, JA: AUTHOR [+9]

Abstract

Disclosed is a mechanically and electrically integrated packaging design for ease of manufacturing, small volume, low weight and system flexibility.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Integrated Packaging Design

      Disclosed is a mechanically and electrically integrated
packaging design for ease of manufacturing, small volume, low weight
and system flexibility.

      The basic components of the design include a thin, "unitized"
base (1) constructed from a thin polymer or dielectric-coated metal
with reinforcing ribs and structures; 3-dimensional circuitry (2)
applied on the surfaces of the base piece(s) and that connects to
switches installed in the cover, connectors, passive components,
etc., and connectors (3) integrated into the base circuitry:
Elastomeric, anisotropic materials, or conventional type connectors
may be utilized.  Circuit cards (4) and other components are wired
through these connectors and 3-d circuitry.

      Methods for making electrical interconnections between the
substrate, 3-d circuitry and cards or components are illustrated in
Figs. 1, 2, and 3.

      The above components are configured to eliminate cables from
the assembly, provide ease of assembly, reduce number of parts,
reduce weight and volume, and provide increased reliability and
performance by reducing the number of interconnections and cables.