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Browse Prior Art Database

Leadless Chip Carrier Removal with Blade Type Solder Iron Tips

IP.com Disclosure Number: IPCOM000113375D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 68K

Publishing Venue

IBM

Related People

Downey, KA: AUTHOR

Abstract

Disclosed is a method for removal of Leadless Chip Carriers (LCCs) using two soldering irons equipped with blade type tips. This method provides a low cost alternative to hot gas, hot air and vapor phase equipment. It is less likely to cause damage to printed circuit boards or adjacent parts than other bench top equipment.

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This is the abbreviated version, containing approximately 71% of the total text.

Leadless Chip Carrier Removal with Blade Type Solder Iron Tips

      Disclosed is a method for removal of Leadless Chip Carriers
(LCCs) using two soldering irons equipped with blade type tips.  This
method provides a low cost alternative to hot gas, hot air and vapor
phase equipment.  It is less likely to cause damage to printed
circuit boards or adjacent parts than other bench top equipment.

      Removal of LCCs requires that all solder connections be molten
simultaneously when part is lifted from the assembly.  Hot air, hot
gas equipment is commercially available that will provide localized
heat to affected locations.  These methods can cause reflow of
adjacent solder connections during the reflow process and can damage
printed circuit board materials when prolonged heat cycles are
required.  Commercially available hand held devices for LCC removal
cover the solder joints during the process and visual determination
of simultaneous reflow is not possible.  Because of this limitation
premature lifting of device can cause lifted lands or circuitry.

      The disclosed method uses two blade type tips to reflow solder
joints on two sides of an LCC device.  This method will work on LCCs
with up to 32 pads.  The heat is conducted through the ceramic body
of the device and the solder joints on the remaining two sides reflow
within 10 seconds.  The blade tips are then pushed inward under the
component and then they are drawn upward to lift the LCC off the
b...