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Structuring of Laminated Cu-Polyimide Films via Laser Ablation

IP.com Disclosure Number: IPCOM000113447D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Lueck, P: AUTHOR [+4]

Abstract

Disclosed is a process for the structuring of laminated Cu-polyimide films having sufficient adhesion of the metal film to the polyimide.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 76% of the total text.

Structuring of Laminated Cu-Polyimide Films via Laser Ablation

      Disclosed is a process for the structuring of laminated
Cu-polyimide films having sufficient adhesion of the metal film to
the polyimide.

      By means of this process vias can be produced in a laminated
Cu-polyimide sandwich even by dry etching with a laser.  The amount
of process steps during the structuring of vias of laminated
Cu-polyimide sandwiches can be drastically reduced.  No complex and
costly photosteps have to be performed anymore.  Moreover, through
holes as well as blind holes can be manufactured by respective choice
of the parameters.

      The described process is a so called "direct process" and thus
is perfectly suited for a lowcost "reel-to-reel" or "wheel-to-wheel"
treatment.

      The process starts from a standard one or two side lamination
of copper on a polyimide film.  Typically these copper layers have a
thickness of about 10 to 18 m.

      By means of known processes (e.g., wet chemical etching) the
copper layer is reduced to a thickness of about 1 to 5 m, preferably
by the so called "Fluid Head" method.

      For the formation of the via holes an excimer laser radiation
of high power density is now used in a third step by means of which
it is possible to dry etch the thinned copper layer as well as the
underlying polyimide layer.

      Preferably, a KrF excimer laser radiation is used having a
power density of at least 15 J/cm2.  Thus, we...