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Browse Prior Art Database

Thin Film Peeler Tool

IP.com Disclosure Number: IPCOM000113462D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 96K

Publishing Venue

IBM

Related People

Harrington, JT: AUTHOR [+4]

Abstract

A tooling system is described which automatically peels a protective thin film from a semiconductor wafer by applying a tacky or adhesive side of a tape to the surface of the protective thin film.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Thin Film Peeler Tool

      A tooling system is described which automatically peels a
protective thin film from a semiconductor wafer by applying a tacky
or adhesive side of a tape to the surface of the protective thin
film.

      Semiconductor wafers are processed to provide integrated
circuits therein with the use of photoresist layers.  These
photoresist layers may take the form of a thin film which adheres to
the surface of the semiconductor wafer.  Since there may be a time
delay between the application of the photoresist thin film and a
subsequent etching process, with a considerable amount of handling of
the wafer in between, a protective thin film, such as MYLAR*, is
applied over the photoresist thin film.

      When the protective thin film is to be removed from the wafer,
a robot, generally indicated at 10 in the figure, picks a wafer from
an appropriate wafer carrier 12, 14 or 16 and transports it to a
pre-aligning station 18.  In station 18, the wafer is held in place
by vacuum on a spindle which rotates the wafer slowly while a sensor
scans the wafer to detect any wafer eccentrical offset.  Any offset
is then adjusted by the robot 10 until the wafer is centered.  Once
this is accomplished, the wafer is rotated one more time to set the
notch orientation.

      The robot 10 then places the wafer on a chuck or pedestal 20
shown in the figure which is lifted into the peeler tool 22 where it
is held securely in place by using known vacuum techniques.  This
lifting step is required because a peeler head assembly 24 is mounted
in a chamber 26 where a negative atmosphere is maintained.  The
negative atmosphere insures that any dirt generation from the peeler
mechanism or the tape itself does not fall upon an unprotected
photoresist surface on the wafer during or after the peeling process.

      The peeler head assembly 24 includes peeler head rollers 28
mounted on a vertical axis mechanism 30 which in turn is mounted on a
horizontal axis mechanism 32.  A peeling tape supply roll 34 is
mounted on a spindle with an adjustable drag, with a take-up roll 36
mounted on another spindle which is motor driven.  A tape 38 is
threaded, with its tacky side facing towards the wafer, from the
supply roller 34 around the peeler hea...