Browse Prior Art Database

Solder Removal Device

IP.com Disclosure Number: IPCOM000113470D
Original Publication Date: 1994-Aug-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR

Abstract

A device developed for efficient removal of solder from small objects is illustrated in the Figure. Low RPM rotating drum 1, covered with braided copper wire ribbon 2, driven by drive mechanism 3 and drive shaft 4, is mounted in thermostatically controlled heating vessel 5. The vessel is filled with a heat transfer fluid 6, which is heated to a temperature higher than the melting point of the solder to be removed from the object of solder removal 7. The object of solder removal 7 is immersed in the heat transfer fluid such that the solder to be removed contacts rotating braided copper wire ribbon which removes the molten solder via capillary action.

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Solder Removal Device

      A device developed for efficient removal of solder from small
objects is illustrated in the Figure.  Low RPM rotating drum 1,
covered with braided copper wire ribbon 2, driven by drive mechanism
3 and drive shaft 4, is mounted in thermostatically controlled
heating vessel 5.  The vessel is filled with a heat transfer fluid 6,
which is heated to a temperature higher than the melting point of the
solder to be removed from the object of solder removal 7.  The object
of solder removal 7 is immersed in the heat transfer fluid such that
the solder to be removed contacts rotating braided copper wire ribbon
which removes the molten solder via capillary action.