Browse Prior Art Database

Engineering Change Interposer

IP.com Disclosure Number: IPCOM000113572D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Gutierrez, BL: AUTHOR [+2]

Abstract

The ability to make a rapid, low-cost Engineering Change (EC) to a module which is mounted on an electronic card assembly used in a high-performance box is needed. The invention described below allows lines to be added, deleted, or interchanged to correct a netlist mistake. It can be used on either organic or ceramic interposers.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 91% of the total text.

Engineering Change Interposer

      The ability to make a rapid, low-cost Engineering Change (EC)
to a module which is mounted on an electronic card assembly used in a
high-performance box is needed.  The invention described below allows
lines to be added, deleted, or interchanged to correct a netlist
mistake.  It can be used on either organic or ceramic interposers.

      An "EC Interposer" consists of a 2 to 4 signal, 1 to 6
power/ground layer structure of the same dimensions as the interposer
whose wiring it corrects; i.e., a 25 x 25mm module would use a 25 x
25mm EC interposer.  Typically two signal layers would be used to
reroute lines, providing one x-wiring layer and one y-wiring layer.
The ground planes provide electrical shielding and can be used to
create a triplate structure to maintain signal quality at < 1 nsec
rise times.  The material used to make the interposer can be any
laminate material, i.e., epoxy, polyimide, cyanate-ester, or
polytetrafluoroethylene.  A delete consists of masking off the
connection to the module so that electrical contact is not made.  A
line can be added by using the interposer to connect a line from a
spare pad to a signal pad on the module.  Line interchanges are
accomplished by using the two wiring layers of the interposer to
route the module pad of the first line to the card pad of the second
line, and vice versa.  Making an interposer using existing card
manufacturing processes is more rapid and cheaper than
rema...