Browse Prior Art Database

Pin Fin Array Heat Pipe Apparatus

IP.com Disclosure Number: IPCOM000113577D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Bellar, RJ: AUTHOR [+2]

Abstract

The disclosed device is a method and apparatus that incorporates heat pipe structure into the pin fin array heat sink to provide very effective cooling for high speed microprocessor chips such as Pentium without the typical problems associated with bulky heat pipes or large heat sinks. The subject device solves the space problem while providing extremely effective cooling.

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Pin Fin Array Heat Pipe Apparatus

      The disclosed device is a method and apparatus that
incorporates heat pipe structure into the pin fin array heat sink to
provide very effective cooling for high speed microprocessor chips
such as Pentium without the typical problems associated with bulky
heat pipes or large heat sinks.  The subject device solves the space
problem while providing extremely effective cooling.

      The pentium, 486dx's successor, will have to be cooled by a
heat sink with a fan mounted directly on this due to the high amount
of heat generated by the  microprocessor.  As shown in the attached
figure the area of the heat dissipating microprocessor 1 causes the
working fluid inside the base of the heat sink(evaporator section 2)
to evaporate and flow to the pins 3 of the upper heat pipe heat sink.
Each pin 3 has been drilled or hollowed with longitudinal grooves.
This is to allow the vapor of working fluid to condense and flow
along the grooves back to the evaporator section 2 by the capillary
action and gravity as it transfers heat to the outside ambient.
Those familiar with the art of heat pipes understand their operation
well and no attempt to teach them will be made here.  It is worth
mentioning that heat pipe characteristics are very dependent on the
working fluid selected (water, alcohol and  others) and the operating
temperature range in which the device will be  applied.  Also, the
size of grooves and the diameter of the fin used to...