Browse Prior Art Database

Welding Joint of Lead Frame

IP.com Disclosure Number: IPCOM000113578D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Related People

Nishida, H: AUTHOR

Abstract

Disclosed is a joint construction of lead frames on stacked plastic packages, which provides electrical conductivity and mechanical strength. Welding method is used for the joining. I. Conventional/Currently Using Method

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Welding Joint of Lead Frame

      Disclosed is a joint construction of lead frames on stacked
plastic packages, which provides electrical conductivity and
mechanical strength.  Welding method is used for the joining.
  I.  Conventional/Currently Using Method

      Fig. 1 shows the examples of three dimensional (3D) packages
construction.  Fig. 2 shows another stacking module which is 4 high
stacking module or 2 high stacking module.  3D packages, which are
constructed by multiple devices/components fabricated by three
dimensional packaging, are recently getting become popular because of
its advantages.  3D packaging can realize the next generation's
technologies utilizing the currently available technologies.  3D
technologies adopt soldering for its electrical and mechanical
joinings between lead frames of the each decks.  In order to keep the
mechanical joint at the next processes, such as card assembly and
module rework, adhesive is applied between each decks.  Current
process for the 3D packages is organized with solder applying
process, adhesive applying process, component stacking process,
soldering (reflow) process, cleaning process and drying process.
  II.  New Method  (This way)

      Welding joining method between lead frames is proposed in stead
of soldering.  Mechanical strength and electrical conductivity of the
joining points can be controlled by adjustment of the size of welding
mark.  Increasing the size of welding mark increases...