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Browse Prior Art Database

Stand-Off Constructed Tape Carrier Package

IP.com Disclosure Number: IPCOM000113590D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Nishio, T: AUTHOR [+3]

Abstract

This article describes a Tape Carrier Package (TCP) which has stand-off coat on the bake sid of TCP tape. The stand-off coat is located along the edge of Outer Lead Bonding (OLB) leads in order to keep a certain space between tape and Printed Wiring Board (PWB) at soldering, which enable each of soldered joints to be steady fillet for improvement of solder joint quality and reliability.

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Stand-Off Constructed Tape Carrier Package

      This article describes a Tape Carrier Package (TCP) which has
stand-off coat on the bake sid of TCP tape.  The stand-off coat is
located along the edge of Outer Lead Bonding (OLB) leads in order to
keep a certain space between tape and Printed Wiring Board (PWB) at
soldering, which enable each of soldered joints to be steady fillet
for improvement of solder joint quality and reliability.

      The soldering process in general uses heat-block such as
constant heat or pulse heat to melt solder.  Conventional TCP shows
the different solder fillet between leads near chip and leads far
from chip due to different tape flexibility as shown in Fig. 1 in the
case that no lead forming is applied prior to soldering.

      Fig. 2 shows the example of stand-off constructed TCP which can
get steady solder fillet of all outer leads.

      In order to obtain the same outcome, some coat or tape can be
applied on the surface of PWB instead of the surface of TCP.