Browse Prior Art Database

Unzipping Polymers for Cost Performance Packaging using the Parallel Process

IP.com Disclosure Number: IPCOM000113629D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Gallo, AR: AUTHOR [+3]

Abstract

Serial Parallel Processing (SPP) is seen as a way to reduce the long cycle time associated with processing many serial polymer layers in the fabrication of high performance packages. This cycle time reduction is more important than ever given multiple size substrate and variable number of layer requirements by customers. Given the high cost of highly automated processing tools required for high yield, the fact that one size thin film carrier can be used for processing and later cut to the proper size for the customer is highly desirable. SPP is also seen as a way to improve module yield, given that only good substrates and good thin films are joined.

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Unzipping Polymers for Cost Performance Packaging using the Parallel
Process

      Serial Parallel Processing (SPP) is seen as a way to reduce the
long cycle time associated with processing many serial polymer layers
in the fabrication of high performance packages.  This cycle time
reduction is more important than ever given multiple size substrate
and variable number of layer requirements by customers.  Given the
high cost of highly automated processing tools required for high
yield, the fact that one size thin film carrier can be used for
processing and later cut to the proper size for the customer is
highly desirable.  SPP is also seen as a way to improve module yield,
given that only good substrates and good thin films are joined.

      The parallel process for fabricating cost effective MCM-D
modules calls for building multi-layer thin film structures on
sacrificial carriers and later transferring the wiring layers to
product substrates of choice (*).  The process uses a polyimide layer
as a release layer to separate the thin film aggregate from the
sacrificial layer by a laser ablation process.  This invention
teaches a more cost effective method to separate the thin film layers
from the build carrier.

      This process replaces the release polymer layer by one that
decomposes at a prescribed high temperature.  After the thin film
layers have been fabricated, a simple temperature excursion to the
prescribed temperature will effect the separation o...