Browse Prior Art Database

High Density Compliant Connector and Socket

IP.com Disclosure Number: IPCOM000113659D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Related People

Li, H: AUTHOR [+2]

Abstract

Multi-Chip-Modules (MCM) provide an effective packaging solution for ever increasing integrated circuit speeds and densities. The close packing of the chips on multi-chip carrier improves the electrical performance due to short path lengths. The MCM also reduces packaging cost when compared to the single chip module solutions.

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High Density Compliant Connector and Socket

      Multi-Chip-Modules (MCM) provide an effective packaging
solution for ever increasing integrated circuit speeds and densities.
The close packing of the chips on multi-chip carrier improves the
electrical performance due to short path lengths.  The MCM also
reduces packaging cost when compared to the single chip module
solutions.

      The Pin-Grid-Array (PGA) and Ball-Grid-Array (BGA) are the two
methods available to attach an MCM to the second level carrier like
printed circuit board.  As the MCM size increases, both the assembly
process and repair/rework process becomes a problem due to the large
number of I/O pins.  Further the inspection of array joints for
manufacturing defects and quality control is not very practical.  For
large MCMs, solder joint reliability is also of concern due to
thermal stresses created by differential expansion of various
materials used in the packaging.

      Many alternative attachment techniques have been proposed and
built to make non-solderable Z-axis interconnections [1-5].  These
range from anisotopic conductive polymer, spring clips to wire
buttons.  All methods use an interposer approach combined with
compressive force to make electrical connection.

      The use of a demountable and compliant Z-axis electrical path
for large I/O packages addresses the manufacturing and reliability
issues mentioned above.   The Figure shows the basic concept of such
a package.  The size of the compliant...