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Browse Prior Art Database

Customer Upgradeable Personal Computer Memory Card International Association Central Electronic Complex Package

IP.com Disclosure Number: IPCOM000113754D
Original Publication Date: 1994-Sep-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Brewer, J: AUTHOR [+3]

Abstract

Disclosed is a customer upgradeable Personal Computer Memory Card International Association (PCMCIA) form factor Central Electronic Complex (CEC). The package consists of the base CEC unit, which is packaged in a thin metal case. A separate removable top cover (which either slides on or snaps into place) is attached to cover the opening or openings through which the upgrade units will attach ((a) in the Figure).

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 90% of the total text.

Customer Upgradeable Personal Computer Memory Card International
Association Central Electronic Complex Package

      Disclosed is a customer upgradeable Personal Computer Memory
Card International Association (PCMCIA) form factor Central
Electronic Complex (CEC).  The package consists of the base CEC unit,
which is packaged in a thin metal case.  A separate removable top
cover (which either slides on or snaps into place) is attached to
cover the opening or openings through which the upgrade units will
attach ((a) in the Figure).

      Parallel board to board connector(s) ((b) in the Figure) are
mounted on the CEC board (c).  The mating opening of these connectors
is above the board and matches with an opening in the top of the
metal case of the package into the empty space below the sliding
cover (d).  The required modules are mounted on a small circuit board
with the mating connector protruding downward from the package (e).
A thin metal shell is used to package the memory board and an
electrically insulating thermally conductive foam provides both
support to the aluminum shell and thermal path from the modules.

      To add the additional memory, the top cover is removed, the
desired memory module or modules are plugged in to the openings in
the CEC package, mating the parallel board to board connectors, and
the top cover is replaced to close the package.  In this way it is
possible for a customer to add additional memory or other optional
features. ...