Browse Prior Art Database

Enhanced Thermosyphon Cooling Scheme

IP.com Disclosure Number: IPCOM000113764D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Chrysler, GM: AUTHOR [+3]

Abstract

A method for enhancing the thermal performance of a thermosyphon loop is presented. Thermoelectric modules are used to reduce the circuit junction temperatures, increase the rate of boiling in the evaporator, increase the rate of condensation in the condenser, and increase the rate of convective heat transfer to the cooling air.

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This is the abbreviated version, containing approximately 74% of the total text.

Enhanced Thermosyphon Cooling Scheme

      A method for enhancing the thermal performance of a
thermosyphon loop is presented.  Thermoelectric modules are used to
reduce the circuit junction temperatures, increase the rate of
boiling in the evaporator, increase the rate of condensation in the
condenser, and increase the rate of convective heat transfer to the
cooling air.

      The idea behind the invention is to use thermoelectric modules
to enhance the performance of a thermosyphon loop.  A schematic of
such an enhanced thermosyphon loop is shown in the figure.  A typical
thermosyphon loop consists of an electronic module (100) attached to
an evaporator (101).  Energy dissipated by the chips in the
electronic module causes the coolant in the evaporator to boil.
Vapor produced in the evaporator travels up through the vapor line
(102) to a condenser (103), where heat transfer via the heat sink

(104) to air condenses the coolant.  The coolant then travels by
gravity down through the condensate line (105) back to the
evaporator, completing the loop.  For the enhanced thermosyphon loop
a thermoelectric module (or an array of modules) (106) is placed
between the electronic module and the evaporator.  This will allow
the electronic module to operate at a lower temperature, while at the
same time elevate the temperature of the evaporator - providing
enhanced boiling.  At the condenser a similar addition of a
thermoelectric module (or array of modules) (107) betwe...