Browse Prior Art Database

Double-Sided, Replaceable, Dendrite-Plated Interposer for Connector Applications

IP.com Disclosure Number: IPCOM000113775D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 66K

Publishing Venue

IBM

Related People

Frankeny, JA: AUTHOR [+2]

Abstract

Disclosed is an electrical interconnection device which consists of palladium dendrite-plated pads on opposite sides of an flexible, insulating substrate and vias or plated-through holes connecting the dendrite-plated pads on opposite sides of the substrate. This palladium dendrite-plated interposer provides electrical connection between arrays of connection pads on two different electrical components or sub-assemblies. It consist of a flexible layer of electrically insulating material into which an array of plated-through holes or through-vias have been formed and metallized. These plated-through holes or vias match the pattern of connection points on the components or subassemblies to be electrically connected.

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Double-Sided, Replaceable, Dendrite-Plated Interposer for Connector
Applications

      Disclosed is an electrical interconnection device which
consists of palladium dendrite-plated pads on opposite sides of an
flexible, insulating substrate and vias or plated-through holes
connecting the dendrite-plated pads on opposite sides of the
substrate.  This palladium dendrite-plated interposer provides
electrical connection between arrays of connection pads on two
different electrical components or sub-assemblies.  It consist of a
flexible layer of electrically insulating material into which an
array of plated-through holes or through-vias have been formed and
metallized.  These plated-through holes or vias match the pattern of
connection points on the components or subassemblies to be
electrically connected.  This array of plated-through holes is then
plated with palladium dendrites in order to form electrical contact
pads on opposite sides of the part.  This is illustrated in Fig. 1.

      Connection between the components is achieved by aligning and
clamping the connection pads of one component or subassembly against
the connection pads of the other component or subassembly with the
interposer properly aligned and trapped between them.  This is
illustrated in Fig. 2.

      This device has several advantages over current methods of
interconnecting area array components.  Because it has a very simple
structure (compared to a multi-layer circuit card, for examp...