Browse Prior Art Database

Hermetic, High Density Feedthrough Interconnection

IP.com Disclosure Number: IPCOM000113819D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Parker, DE: AUTHOR

Abstract

An ever-increasing variety of complex microcircuits are being designed which, due to severe operating environments and high reliability requirements, need to be hermetically sealed. In addition, the increasing usage of commercial electronic components in rugged military and space applications may require the use of hermetic enclosures to provide an additional level of protection against the damaging effects of hostile environmental conditions. As the complexity of these microcircuit components continues to increase, the space necessary to support I/O requirements using standard glass frit sealed, single point hermetic pins and feedthroughs becomes prohibitive.

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Hermetic, High Density Feedthrough Interconnection

      An ever-increasing variety of complex microcircuits are being
designed which, due to severe operating environments and high
reliability requirements, need to be hermetically sealed.  In
addition, the increasing usage of commercial electronic components in
rugged military and space applications may require the use of
hermetic enclosures to provide an additional level of protection
against the damaging effects of hostile environmental conditions.  As
the complexity of these microcircuit components continues to
increase, the space necessary to support I/O requirements using
standard glass frit sealed, single point hermetic pins and
feedthroughs becomes prohibitive.  The challenge of this problem is
to devise a method for bringing large numbers of closely spaced I/O
interconnections out of a protective enclosure while maintaining its
hermeticity.

      This invention describes a novel design for a high density
hermetic electrical feedthrough interconnection.  It proposes the use
of a co-fired multilayer ceramic (MLC) substrate of unique design as
shown in Fig. 1.  Features of the design include the MLC substrate
(1), top-surface metallization for inner and outer attach pads (2),
separated by a metallized seal band (3) extending around all four
sides of the substrate.  Electrical interconnection between the inner
and outer attach pads is provided by metal-filled vias and conductive
metal lines buried within...