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Automated Laser Driver Laser-Planarisation Process

IP.com Disclosure Number: IPCOM000113823D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Doany, F: AUTHOR [+4]

Abstract

This disclosure reveals a technique for the automated planarisation of polymer coated surfaces which may contain metallic, organic or inorganic structures.

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This is the abbreviated version, containing approximately 100% of the total text.

Automated Laser Driver Laser-Planarisation Process

      This disclosure reveals a technique for the automated
planarisation of polymer coated surfaces which may contain metallic,
organic or inorganic structures.

      Various areas of engineering endeavor require that planar
surfaces be generated from originally undulating or non-parallel
layers.  A technique is described here which allows the use of a
laser beam to planarise  various films.  The laser is mounted either
perpendicular or parallel to a substrate which is levelled on a
global scale.  The levelling process is accomplished by means of
sensors placed at specific locations above the substrate.  The laser
is chosen for its wavelength characteristics which provide for the
ablation or removal of a specified material.  A distance sensor is
provided which measures the distance to the substrate from a
specified point, and the laser beam is arranged to fall on the same
location.  The required thickness of material is removed with the
laser while monitoring the height of the material with the distance
sensor.  The part is then moved to a fresh location (or the
laser/sensor combination is scanned or moved) and the process
repeated, while maintaining the global plane of the substrate.  A
typical embodiment of this procedure is shown in the Figure.
Although the laser is shown operating perpendicular to the substrate,
the angle is not important.  Any angle can be used.