Browse Prior Art Database

Surface-Mounted Component Removal Process

IP.com Disclosure Number: IPCOM000113846D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR [+2]

Abstract

The process illustrated in the Figure was developed to remove Kovar*-cased surface-mounted components from printed wiring boards. Hot heat transfer fluid 1 is contained in nozzle 2. Permanent magnet 3 is supported inside of nozzle 2 on perforated plate 4. Surface-mounted component 5, soldered to printed wiring board 6, is immersed in the hot heat transfer fluid 1. The solder in solder joints 7 reflows, permitting permanent magnet 3 to remove surface-mounted component 5 from printed wiring board 6. * Trademark of Carpenter Technology Company.

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Surface-Mounted Component Removal Process

      The process illustrated in the Figure was developed to remove
Kovar*-cased surface-mounted components from printed wiring boards.
Hot heat transfer fluid 1 is contained in nozzle 2.  Permanent magnet
3 is supported inside of nozzle 2 on perforated plate 4.
Surface-mounted component 5, soldered to printed wiring board 6, is
immersed in the hot heat transfer fluid 1.  The solder in solder
joints 7 reflows, permitting permanent magnet 3 to remove
surface-mounted component 5 from printed wiring board 6.
  *  Trademark of Carpenter Technology Company.