Browse Prior Art Database

Processor/Memory Electronics Package

IP.com Disclosure Number: IPCOM000113887D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 77K

Publishing Venue

IBM

Related People

Choudhury, A: AUTHOR [+9]

Abstract

Disclosed is a method to mount large form factor memory Single In-line Memory Modules (SIMMs) (approximately 250 mm by 80 mm) into a processor electronics package. Memory SIMMs are installed into the processor book thru an access cover which provides for easy field replacement and upgrade.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 99% of the total text.

Processor/Memory Electronics Package

      Disclosed is a method to mount large form factor memory Single
In-line Memory Modules (SIMMs) (approximately 250 mm by 80 mm) into a
processor electronics package.  Memory SIMMs are installed into the
processor book thru an access cover which provides for easy field
replacement and upgrade.

      Fig. 1 shows the assembled package with the access cover 1 in
place.  Fig. 2 shows the access cover removed and one of the large
form factor SIMM cards 2 removed from the package.  The SIMM cards
may be affixed with latches 3 to aid in installation and removal.

      Fig. 3 shows an exploded view of the package with the access
cover and all of the SIMM cards removed.  The processor card 9 is
mounted to the covers 4 and is electrically connected to the system
thru the system connectors 10.  The SIMM cards are attached to the
processor card thru the SIMM connectors 11.  This integrated
processor/memory bus within the package provides for improved
processor performance.  A latching frame 8 attaches to the cover and
provides the structure to engage/disengage the SIMM cards when
connector insertion forces are high.  The latching frame may also
provide alignment rails to locate the SIMM cards during installation.
The connector plate 6, tail stock 7, and rails 5 are attached to the
covers completing the package enclosure.  Note; the rails may also
have latches 12 to assist in installation and removal to the system
board (no...