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Damage-free Laser Ablation Removal of Organic Materials

IP.com Disclosure Number: IPCOM000113932D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Zapka, W: AUTHOR

Abstract

Disclosed is a process for laser ablation removal of organic materials from silicon or metal surfaces without causing damage to the surface by using polarized laser light.

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Damage-free Laser Ablation Removal of Organic Materials

      Disclosed is a process for laser ablation removal of organic
materials from silicon or metal surfaces without causing damage to
the surface by using polarized laser light.

      The ablation rate of organic material does not depend on the
polarization direction of linear polarized laser light with oblique
incidence angle, as shown in Fig. 1.

      The reflectance of metal surfaces however clearly depends on
the polarization direction of linear polarized laser light, as seen
in Fig. 2.

      Using perpendicular polarized laser light at incidence angles
of about60 degree to about 80 degree completely ablates organic
material and shows a much higher reflectance R[-] efficiency than the
parallel polarized laser light component with reflectance R[||].

      Thus the damage caused in silicon or metal substrates may be
decreased drastically compared to the use of parallel polarized laser
light of the same energy density.