Browse Prior Art Database

Package for Surface Emitting or Surface Illuminated Devices

IP.com Disclosure Number: IPCOM000113939D
Original Publication Date: 1994-Oct-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 70K

Publishing Venue

IBM

Related People

Chiu, GL: AUTHOR [+3]

Abstract

Disclosed is a means for packaging optoelectronic devices which are surface emitting or illuminated using a transparent block which makes use of self-aligning techniques, integrates function, and is readily adaptable to batch processing techniques.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Package for Surface Emitting or Surface Illuminated Devices

      Disclosed is a means for packaging optoelectronic devices which
are surface emitting or illuminated using a transparent block which
makes use of self-aligning techniques, integrates function, and is
readily adaptable to batch processing techniques.

      The Figure depicts the approach.  A transparent block is
mounted vertically with respect to the substrate.  The substrate has
the remaining optoelectronic supporting chips.  Because the block is
transparent, patterns on the left surface and those on the right
surface can be aligned lithographically.  Specifically, the right
side of the block is patterned with C4 pads such that the
photodetector or emitter chips can be attached using C4 techniques.
It has been shown that C4 self-alignment is capable of +  2&mu.m or
better (1).  This is sufficient for the photodetector.  The left
surface can provide a lens for focusing if necessary.  The block can
be inserted into a connector housing.  The alignment of the block to
the connector housing can be made by precision control of the outer
block diameter and inner diameter of the housing.  Alignment
accuracies on the order of several microns can be expected from such
an approach based on state of the art precision machining of bores
and ferrules for singlemode fiber optics.  Thealignment accuracy may
be further extended by patterning the block with mechanical features
or solder pads which would mate into corresponding features in the
connector housing.  The critical alignments are all accomplished with
the lef...