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Browse Prior Art Database

CPU Cooling System for Notebook PC

IP.com Disclosure Number: IPCOM000114037D
Original Publication Date: 1994-Nov-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Ishihara, Y: AUTHOR [+3]

Abstract

Disclosed is a cooling system designed for Notebook PC. The subject system comprises (1) Heat Absorption Plate, (2) Heat Pipe and (3) Heat Sink. Heat conveying performance of the subject system is quite higher than any other conventional cooling systems.

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CPU Cooling System for Notebook PC

      Disclosed is a cooling system designed for Notebook PC.  The
subject system comprises (1) Heat Absorption Plate, (2) Heat Pipe and
(3) Heat Sink.  Heat conveying performance of the subject system is
quite higher than any other conventional cooling systems.

      The Heat Absorption Plate is horizontally located on the top
side of the Daughter Card, whose heat density may be high, and which
is separated from a main planar card.  The Heat Sink is also
horizontally located on the bottom side of the card.  The Heat Sink
and the Heat Pipe are firmly connected with each other.  The Heat
Sink extends to the large bottom area in the PC.

      A large amount of heat can be transferred from Daughter Card to
Heat Sink without time delay.  The whole unit of the subject system
is enough thin to be installed in not only a Notebook PC but in
another small electrical product.