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Browse Prior Art Database

Adapter for Ball Grid Array Sockets and Land Grid Array Sockets

IP.com Disclosure Number: IPCOM000114044D
Original Publication Date: 1994-Nov-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 4 page(s) / 84K

Publishing Venue

IBM

Related People

Vanderlee, KA: AUTHOR

Abstract

Disclosed is a device for attaching a ball grid array socket or land grid array socket to a standard circuit card without using holes in the circuit card or precious metal contact metallurgy on the circuit card pads.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 63% of the total text.

Adapter for Ball Grid Array Sockets and Land Grid Array Sockets

      Disclosed is a device for attaching a ball grid array socket or
land grid array socket to a standard circuit card without using holes
in the circuit card or precious metal contact metallurgy on the
circuit card pads.

      Sockets that are commonly available for ball grid array and
land grid array modules require that the circuit card on which they
are mounted contain at least four mounting holes and that the pads on
the circuit card be plated with gold.  This causes two problems:  1.
The holes through the circuit card block many wiring channels, and
thus reduce the wiring capacity of the circuit card.  2.  The gold
plating must be selectively applied to the socket pads in the middle
of the card.  This requires special processing steps and increases
the cost and complexity of the circuit card.

      This invention is an adapter for ball grid array and land grid
array sockets (Fig. 1).  This adapter is soldered to the to the
circuit card in the normal card assembly process.  It provides gold
plated pads and tapped holes on its top side so that a ball grid
array socket can be mounted to the adapter in the same way a socket
can be mounted to the base circuit card (Fig. 2).  This avoids
drilling holes and adding gold plating to the circuit card.

      The adapter consists of a high elastic modulus stiffener
member, a polymer insulating layer covering the stiffener,
gold-plated coppe...