Browse Prior Art Database

Vapor Phase CU for Binder Burnoff

IP.com Disclosure Number: IPCOM000114063D
Original Publication Date: 1994-Nov-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Chance, DA: AUTHOR [+2]

Abstract

This article describes a technique which enhances binder burnoff from green ceramic stacks by means of vapor transported Cu in a reducing or neutral ambient.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 60% of the total text.

Vapor Phase CU for Binder Burnoff

      This article describes a technique which enhances binder
burnoff from green ceramic stacks by means of vapor transported Cu in
a reducing or neutral ambient.

      One of the difficult problems in fabricating multilayer glass
ceramic is that of complete binder burnoff prior to densification.
In the case of 397 glass ceramic it is imperative that binder burnoff
be completed at temperatures below ~780ºC.  If not
completed the residual carbon is trapped in the densifying glass
causing degraded dielectric properties of the fired glass ceramic.
For 1000ppm of residual carbon the observed result is an apparent
dielectric constant of ~1000 and a tanD of ~10.

      The current technique used to enhance binder burnoff is to add
a metal catalyst, (Ni or Cu) directly to the glass powder slurry and
hence incorporate it into the green sheet.  The included Cu catalyst
enables binder burnoff at 770ºC in 4 hours in an ambient which is
mostly steam but where H&sub2./H&sub2.O ratio is 10 exp - 4 to keep
the ambient reducing to Cu.  Without the catalyst addition 16 hours
is required.

      The catalyst addition to the green sheet sometimes changes the
slurry, green sheet or fired ceramic properties.  It is therefore
desirable that these additions not be made to the material.  We show
in this article that binder burnoff from green ceramic stacks can be
accomplished with vapor transported Cu.  Cu does not have to be
included in...