Browse Prior Art Database

Molding Electro-Magnetic Shielding to Plastic Parts

IP.com Disclosure Number: IPCOM000114109D
Original Publication Date: 1994-Nov-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 73K

Publishing Venue

IBM

Related People

Kuczynski, JP: AUTHOR [+2]

Abstract

Described is a hardware implementation that provides Electro-Magnetic Compatibility (EMC) shielding to be fabricated during the molding of plastic parts. The implementation utilizes an insert molding process so as to eliminate secondary operations for applying EMC shielding.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 56% of the total text.

Molding Electro-Magnetic Shielding to Plastic Parts

      Described is a hardware implementation that provides
Electro-Magnetic Compatibility (EMC) shielding to be fabricated
during the molding of plastic parts.  The implementation utilizes an
insert molding process so as to eliminate secondary operations for
applying EMC shielding.

      Typically, thermoplastics have become the material of choice
for electronic equipment enclosures.  In order to provide the proper
shielding, so as to contain radiated Electro-Magnetic Interference
(EMI), in prior art shielding was applied to the enclosure after the
enclosure was molded.  The concept described herein provides a method
whereby the shielding, for containing the EMI, is provided during the
molding process by means of an insert molding process.

      Fig. 1 shows an isometric view of the metallized thermoplastic
film positioned for molding.  Die-cut metallized plastic film 10 is
designed to accommodate any bosses (not shown) and ventilation slots
11 and is positioned into mold cavity 12 prior to the injection
molding cycle.  Fig. 2 shows a cutout view of how plastic film 10
enables an air/metal interface to exist on the inside surface of the
molded part.  During the molding process, plastic film 10 softens
upon
contact with the hot resin so as to ensure adequate adhesion.  After
molding, the die halves open and the part is ejected.

      Although any suitable thermoplastic film may be used as a
carrier...