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Browse Prior Art Database

Enhanced Planarity Dielectric Process for Thin Film Fabrication

IP.com Disclosure Number: IPCOM000114193D
Original Publication Date: 1994-Nov-01
Included in the Prior Art Database: 2005-Mar-27
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Bickford, HR: AUTHOR [+5]

Abstract

In order to extend the conformal via process for fabricating low cost thin film copper circuitry to thicker wiring or to the use of multiple plane pairs, a dielectric process was developed that achieves enhanced planarity. The method takes advantage of the natural rheological properties of viscoelastic polymeric fluids, and does not introduce additional process steps. As a process extension to a conformal via build this technique allows essentially transparent implementation. This process could also be adopted to increase the inherent planarity of most thin film processes. Use of the enhanced planarity dielectric process permits the fabrication of low cost high performance thin film wiring with multiple plane pairs.

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Enhanced Planarity Dielectric Process for Thin Film Fabrication

      In order to extend the conformal via process for fabricating
low cost thin film copper circuitry to thicker wiring or to the use
of multiple plane pairs, a dielectric process was developed that
achieves enhanced planarity.  The method takes advantage of the
natural rheological properties of viscoelastic polymeric fluids, and
does not introduce additional process steps.  As a process extension
to a conformal via build this technique allows essentially
transparent implementation.  This process could also be adopted to
increase the inherent planarity of most thin film processes.  Use of
the enhanced planarity dielectric process permits the fabrication of
low cost high performance thin film wiring with multiple plane pairs.
The extendability of a conformal via thin film build is limited in
regards to wiring thickness by the additive non-planarity resulting
from successive layer builds.  Although explicit planarization
schemes that involve polishing or lapping type operations may be used
to overcome this they require additional process steps and result in
huge cost increases.  The problem is to achieve enhanced planarity
without a negative impact on the existing process or to increase its
cost.  It is well known that an increase in the planarity of a cast
film results from increasing the coating thickness relative to the
height of the substrate topography.  Unfortunately the electrical
requirements...