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Browse Prior Art Database

New Tape Automated Bonding

IP.com Disclosure Number: IPCOM000114266D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Morimoto, M: AUTHOR [+3]

Abstract

When we tried to make height of Liquid Crystal Display (LCD) module within 195 mm with flat Tape Automated Bonding (TAB) technology, TAB and Printed Circuit Board (PCB) become slimmer. As a result of TAB has become slimmer, TAB Lead become easy to be broken at the end of both side of PCB (Fig. 1).

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This is the abbreviated version, containing approximately 100% of the total text.

New Tape Automated Bonding

      When we tried to make height of Liquid Crystal Display (LCD)
module within 195 mm with flat Tape Automated Bonding (TAB)
technology, TAB and Printed Circuit Board (PCB) become slimmer.  As a
result of TAB has become slimmer, TAB Lead become easy to be broken
at the end of both side of PCB (Fig. 1).

      Therefore, expansion and shrinkage rate of PCB are minimized by
adding an anchor pad beside the driver IC (Fig. 2).  Fixture hole for
TAB soldering can be used for this anchor pad beside the driver IC in
case that there is no space for making independent anchor on TAB tape
(Fig. 3).

      Another mask is not needed because each anchor is made of the
same material as TAB lead.  Also, a big change on the manufacturing
process is not needed because this improvement does not require any
glue.