Browse Prior Art Database

Integrated Optical Mount and Connector Assembly

IP.com Disclosure Number: IPCOM000114370D
Original Publication Date: 1994-Dec-01
Included in the Prior Art Database: 2005-Mar-28
Document File: 2 page(s) / 74K

Publishing Venue

IBM

Related People

Liu, K: AUTHOR [+2]

Abstract

Low cost and simple assembly are critical for opto-electronic modules, particularly multi-channel ones. Typically, such a module contains a mix of mechanical, optical, opto-electronic and purely electronic components. One problem is the need to accomodate dissimilar materials and component heights, and component orientations. Particularly for modules involving arrays, the separation between different components must often be very small, but controlled, and an ideal connector technique would serve the additional function of setting spacings.

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Integrated Optical Mount and Connector Assembly

      Low cost and simple assembly are critical for opto-electronic
modules, particularly multi-channel ones.  Typically, such a module
contains a mix of mechanical, optical, opto-electronic and purely
electronic components.  One problem is the need to accomodate
dissimilar materials and component heights, and component
orientations.  Particularly for modules involving arrays, the
separation between different components must often be very small, but
controlled, and an ideal connector technique would serve the
additional function of setting spacings.

      The current invention is the use of flexible interconnect which
provides for electrical connections between the optoelectronic
component and the electrical components, compensates for any height
difference between them and allows control of the spacing between
vertically stacked components.  The flexible circuit is standard in
the industry, consisting of a polyimide dielectric substrate with
signal, power and ground lines on one or both sides of the
dielectric.  The metal lines are coated with an elastomeric coating
for corrosion protection, electrical isolation and in this case, also
for spacing control.  By virtue of its flexibility, it intrinsically
solves the problem of non-planar components orientation (as shown in
Fig. 1), and also the need for non-destructive close contact between
vertically stacked components and the need for strain relief (as
shown in Fig. 2).

      In the case shown in Fig. 1, a photodetector or optical emitter
array is placed on the side of the submount on which all the other
chips are mounted.  In place of expensive nonstandard techniques to
bring the metallization around the corner of the submount and to do
w...